SANTA CLARA, Calif., April 9, 2013 /PRNewswire/ -- Thermal Engineering Associates, Inc. (TEA) announces that it is now accepting wafer orders for its new 1mm square Thermal Test Chip (TTC-1001). This new chip has many of the same advantages as the popular TEA TTC-1002...
Source : http://www.prnewswire.com/news-releases/thermal-en...
Source : http://www.prnewswire.com/news-releases/thermal-en...